• High efficiency liquid cooling design provides energy savings and carbon reduction
• All I/O and management ports located on the front panels
▸64 x 1.6T OSFP ports
▸2 x 25G SFP28 in band management ports
▸1 x 10M/100M/1G out of band management port (RJ-45)
▸1 x USB Type C console port
▸1 x USB 3.0 Type A port
▸1 x reset button
▸1 x 1PPS I/O SMB
▸1 x 10MHz I/O SMB
▸1 x RJ-45 for ToD
• COM-E Type 7 CPU board design
• BMC modular design
• Tomahawk 6 switching chip
• Optional DC power tray supports +54V Bus Bar for ORV3 rack mounting
• Support EIA/ORv3 rack with liquid cooling solution.